IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
Adaptive 3D Mesh & Curve Mapping
Import Overlays – use X-RAY, C-SAM images to improve targeting
Two RST Versions available- NIR (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
High-Def Digital Cameras — all native 4K (UHD)
Option for (up to) 32” Vision Monitor
Program by Touch, Mouse/Keyboard or REMOTELY
High impedance / small capacitance based — Hardware and Software Upgrade to add end-pointing for enhancement of decap and de-processing
UT-F3 Thickness Reflectance Measurement System Offers single or multi-point non-contact measurement (1280-1340nm) of silicon and other semiconductor substrates – measures down to approx. 10 microns RST. Adds a third 4K (UHD) Camera mounted at the RST Position.
Radiant’s ASAP-1 Project has always aimed to provide user-friendly and sample-friendly tools. The ASAP-1® offers intuitive controls that have helped labs achieve quality results for analysis with Photon emission microscopes, laser/thermal stimulus microscopes, and FIB’s.
3D Curvature Correction, when used alone, or in conjunction with Thermal Relaxation provides a flatter, more planar, backside-thinned and polished die-optimized for SIL, Laser scan and other microscopy techniques. ASAP-IPS offers unique features, including the ability to set Xand Y Axis Curvature Independently. This suilts rectangular dice or where curvature and stree varies between axis. The Unique Autocurve feature sets surve parameters automatically for an ‘unkown’ part.
3D Thermal Relaxation Module (Patent Pending) enhances ASAP-1 IPS toolkit for improving the planarity of warped and curve packaged dice. Controlled heating emulates the thermal profile of a device in service and ‘relaxes’ the substrate, removing die warpage and curvature. Sample preparation is then carried out ‘at temperature’. Thermal Relaxation is key to the successful, high yield, crack free preparation of many package types exhibiting die warpape. In situations of severe die stress, or where the substrates moves substantially during the removal process, further improvements may be seen by utilizing 3D curvature control simultaneously with Thermal. The Thermal stage also acts as a useful ‘in situ’ hot plate for the rapid melting and setting of hot melt waxes such as Crystal Wax.
In-System Materials Charaterization
The High Impedence / small Capacitance End-Point Detection Module (Patent Pending) allows the ASAP-1 IPS to quantify and act upon the capacitive and /or resistive difference in properties between electronic enhance decapsulation and same preparation process results, by removing the guesswork.
ANTIREFLECTIVE COATING SYSTEM FOR BACKSIDE ANALYSIS
Fast and convenient – 45 second process
Up to 30% more transmitted photon efficiency
Up to 60% improved contrast under NIR
Inexpensive to own and operate
Bench-top, quiet, room temp. process
All package types and sizes
RC can be done ‘in-house’ – NO BAKING
Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, FMI, probing, and most other backside techniques
RELATED ACCESSORIES
ARC-lite Standard Mounting Plate
ULTRAPOL Advance has been designed to be an all-in-one lapping & polishing workstation for the production of flat surfaces. Advance’s unbeatable combination of advanced control and process features allow for the accurate processing of modern generations of IC’s
Along with ULTRA TEC’s signature Quick Release interface and workholder technologies, ULTRAPOL Advance offers completely new designs for sample loading, oscillation and tilt alignment. Fast and convenient sample movement between polisher & microscope, coupled with the option of the ULTRACOLLIMATOR optical alignment system, provides reference to the die — a huge improvement over earlier generation polishers.
The system allows recirculating slurry polishing (key for many delayering operations) as well as standard faucet coolant.
For aggressive material removal operations (such as the back-thinning of larger flip chips), a ‘Power polish’ mode is incorporated that rotates the sample during processing.
Better delayering results – The ULTRACOLLIMATOR option allows for improved parallelism, improving the ‘sweet spot’ of the delayered surface.
Fast & repeatable alignment – precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis provide for optical alignment that does not wander.
Slurry polishing – A recirculating pump may be added, in addition to the standard coolant system. Slurries are held within a drip tray for easy disposal, or re-use.
Avoids cross-contamination – The unique slurry / drip tray concept allows convenient removal and cleaning of all items that come into contact with abrasives and polishing media
Industry-leading supplier – ULTRA TEC has supplied sawing, lapping & polishing equipment to the high-tech industries for over 30 years. Our ASAP-1, ARC-lite, MULTIPOL & ULTRAPOL products have set the standard for sample preparation
LOW COST SECTIONING SYSTEM FOR MOBILE CHIPS, DEVICES & INDUSTRY SAMPLES
Suits Low Budgets
Manual Crank Table Feed, with motor option
Z-Spindle Option adds easy ability to adapt to sample height
Chip-Off for Digital Forensics
Fish & Game Samples
Industrial Samples
Ultraslice Macrotome Saw: 8520.4
Z-Spindle Upgrade – 8520.4Z
VERSATILE PRECISION SAW WITH Z-SPINDLE
Z-Spindle – Allows for cutting depth to be altered even during operation
Choose
8560.3 ULTRASLICE Diamond Saw – 110V-240V
System package includes: Saw Base Unit,
6000rpm max spindle speed (with tachometer, ammeter),
3582.2 X Stage for traveling table,
Y axis motorized traveling table (with automatic cut-out),
Z-spindle Stage,
Recirculating Coolant System & Splash Guard,
One 4″ diamond blade (7412.1),
Pair 2″ dia. flanges (cheek plates)
W Rotational Stage – 3590.1
Substrate Holder (+ 4 substrates) – 3518.4
Vise (for samples up to 2″ dia) – 3575.1
Dicing (Internal) Splash Guard – 3577.1
RELATED ACCESSORIES
Lamp
Substrate Holder
Encapsulated Mount Holder
Vise
W Stage for ULTRASLICE Saw
VERSATILE PRECISION SAW FOR SMALL WORKSPACES & SMALL BUDGETS
Versatility – The system handles samples of most shapes, sizes and orientations.
Cutting Accuracy – precision lead screws on all feed directions
Long Cuts & Dicing – A large work-table and ‘open’ system design allows for longitudinal sectioning and dicing
Sectioned workpieces may be an end in themselves, or the starting point for lapping and polishing
Most Blade Types – a wide range of diamond and abrasive blades is available.
8502.3 System package includes: Saw Base Unit (2000 max rpm spindle speed), 3582.C X Stage for traveling table, Y axis motorized traveling table, Recirculating Coolant System & Splash Guard, One 4″ diamond blade (7412.1), Pair 2″ dia. flanges (cheek plates), 100-240V Operation.
Substrate Holder — table mount – 3518.4
Vise — table mount – 3575.2
Lamp – 1301.5
Automatic Cut-out Switch and Assembly — for unattended operation – 3632.1
RELATED ACCESSORIES
Substrate Holder
Vise
